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| (R) BAT20J HIGH EFFICIENCY SWITCHING AND ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM IR 25C(max) @ 15V Tj (max) 1A 23 V 12 A 150 C A K FEATURES AND BENEFITS Low conduction losses Very low reverse current Negligible switching losses Low capacitance diode Low forward and reverse recovery times Extremely fast switching Surface mount device SOD-323 DESCRIPTION The BAT20J is using 23V schottky barrier diode encapsulated on a SOD-323 package. This is specially suited for switching mode in mobile phone and PDA power management applications or LED driver circuits (step up converters). ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj TL *: Parameter Repetitive peak reverse voltage Repetitive peak forward current Average forward current Maximum storage temperature range Maximum operating junction temperature * Maximum temperature for soldering during * = 0.38 Surge non repetitive forward current (tp=10ms sinusoidal) Value 23 2 1 5 - 65 to +150 150 260 Unit V A A A C C C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) Order code Part Number BAT20JFILM April 2004 - Ed: 1 Marking 20 1/5 BAT20J THERMAL RESISTANCE Symbol Rth (j-a) Junction to Ambient (*) Parameter Value 600 Unit C/W (*) Mounted on epoxy board without copper heat sink. STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameters Reverse leakage current (see note 1) Reverse leakage current Tests conditions Tj = 25C VR = 5 V VR = 8 V VR = 15 V VR = 5 V VR = 8 V VR = 15 V IF = 10 mA IF = 100 mA IF = 1 A Min. Typ. 0.65 0.88 3.00 55 70 120 0.28 0.35 0.54 Max. 2 3 12 120 150 250 0.31 0.40 0.62 V Unit A IR * Tj = 85C VF ** Forward voltage drop Tj = 25C * Pulse test tp = 380 s, < 2% ** Pulse test tp = 5 ms, < 2% Note 1: IR at 23 V and Tj = 25C is equal to 60 A typ. DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Cd Parameters Diode capacitance Tests conditions VR = 5 V F = 1 MHz Min. Typ. 20 Max. 30 Unit pF To evaluate the maximum conduction losses, use the following equations : P = 0.32 x IF(AV) + 0.23 x IF2(RMS) 2/4 BAT20J Fig. 1: Peak forward current versus ambient temperature ( = 0.11). IP(A) 3.0 Printed circuit board FR4 SCU=2.25mm2 Fig. 2: Average forward current versus ambient temperature ( = 0.5). IF(AV)(A) 0.40 0.35 0.30 Printed circuit board FR4 SCU=2.25mm2 2.5 2.0 0.25 0.20 0.15 1.5 1.0 T 0.5 0.10 0.05 0.00 T 0.0 0 =tp/T 25 tp 50 Tamb(C) 75 100 125 150 =tp/T 0 25 tp 50 Tamb(C) 75 100 125 150 Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration . Zth(j-a)/Rth(j-a) 1.E+00 Single pulse 2 SCU=2.25mm Fig. 4: Reverse leakage currrent versus reverse voltage applied (typical values). IR(A) 1.E+04 Tj=150C 1.E+03 1.E-01 1.E+02 Tj=85C 1.E+01 1.E-02 Tj=25C 1.E+00 tp(s) 1.E-03 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 0 2 4 6 8 10 VR(V) 12 14 16 18 20 22 24 Fig. 5: Relative variation of reverse leakage currrent versus junction temperature (typical values). IR(Tj) / IR(Tj=25C) 1.E+04 VR=5V Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25C 1.E+03 1.E+02 10 1.E+01 1.E+00 Tj(C) 1.E-01 0 25 50 75 100 125 150 VR(V) 1 1 10 100 3/5 BAT20J Fig. 7-1: Forward voltage drop versus forward current (typical values, high level). IFM(A) 1.E+01 Tj=150C Fig. 7-2: Forward voltage drop versus forward current (low level). IFM(A) 1.0 0.9 1.E+00 0.8 0.7 Tj=150C (typical values) 1.E-01 Tj=85C 0.6 0.5 Tj=85C (typical values) Tj=25C (typical values) 1.E-02 Tj=25C 0.4 0.3 0.2 Tj=25C (maximum values) 1.E-03 VFM(V) 1.E-04 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 0.1 0.0 0.0 0.1 0.2 0.3 0.4 VFM(V) 0.5 0.6 0.7 Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, e CU =35m, typical values). Rth(j-a)(C/W) 600 550 500 450 400 350 300 250 200 150 100 50 0 0 5 10 15 20 25 30 35 40 45 50 Fig. 9: Thermal resistance junction to ambient versus power dissipation (epoxy printed circuit board FR4, e CU =35m, typical values). Rth(j-a)(C/W) 700 650 600 550 500 450 400 350 300 250 200 150 100 SCU=2.25mm2 Tamb=25C SCu(mm) 50 0 0 50 100 150 P(mW) 200 250 300 350 400 4/5 BAT20J PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS H b E A1 REF. Millimeters Min. Max. 1.13 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 0.1 0.44 0.25 1.8 1.35 2.7 0.46 0.41 0 Inches Min. Max. 0.045 0.004 0.017 0.01 0.071 0.053 0.106 0.02 0.016 0.01 0.004 0.06 0.044 0.09 0.004 0.004 A A1 b D A c D E H L Q1 c Q1 L Ordering type BAT20JFILM Marking 20 Package SOD-323 Weight 0.005g Base qty 3000 Delivery mode Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2004 STMicroelectronics - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - United States www.st.com 5/5 |
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